NBI Newsletter 11/2005:
NBI Announces Plans for Lead-Free Process Kick-Off
Capital Equipment: A new Technical Devices lead-free wave solder
conversion system has been ordered and is scheduled for delivery next month. With the
installation of this equipment, NBI will be able to offer both traditional and lead-free
wave soldering processes on the same machine. The concept is very simple. The same wave
solder machine can be used for both processes by swapping solder pots. This will
accommodate product with or without lead-free requirements. Using the same machine for
both processes will help control costs for customers. The system includes a titanium
solder pot and pump assembly as well as a docking preheat station that will enable process
changes from traditional to lead-free or from lead-free to traditional in a very short
time.
Solder Alloy: NBI has chosen "SAC 305" for lead-free
soldering operations. The "SAC 305" alloy has been recommended by IPC. This
alloy is 96.5 percent tin (SN), three percent silver (AG), and one-half percent copper
(CU).
Board Plating: NBI has reviewed IPC
specifications, discussed customers' needs, and has also consulted with printed circuit
board suppliers about alternatives for hot air solder level (HASL) plating on printed
circuit boards. Based on our research, NBI will be offering three no-lead alternatives:
silver emersion plating, gold emersion plating, and white tin plating. |
